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Electronic Packaging Books
List of Electronic Packaging under the category Electrical & Electronic Engineering from Engineering books.
Books: Page 1 (1 - 25 of 37)
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Thermal Design of Electronic Equipment
Author: Ralph Remsburg
ISBN-13: 9780849300820, ISBN-10: 0849300827
Publisher: Taylor & Francis, Inc.
Date: September 2000 -
Heat Transfer: Thermal Management of Electronics (1st Edition)
Author: Younes Shabany
ISBN-13: 9781439814673, ISBN-10: 1439814678
Publisher: Taylor & Francis, Inc.
Date: December 2009 -
Electronic Packaging and Interconnection Handbook (REV)
Author: Charles A. Harper
ISBN-13: 9780071430487, ISBN-10: 0071430482
Publisher: McGraw-Hill Companies, The
Date: September 2004 -
Practical Guide To The Packaging Of Electronics: Thermal And Mechanical Design And Analysis, Second Edition (REV)
Author: Ali Jamnia
ISBN-13: 9781420065312, ISBN-10: 1420065319
Publisher: Taylor & Francis, Inc.
Date: November 2008 -
Electronic Physical Design (1st Edition)
Author: Barry M. Lunt
ISBN-13: 9780130943873, ISBN-10: 0130943878
Publisher: Prentice Hall
Date: February 2003 -
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering Series)
Author: Karl J. Puttlitz
ISBN-13: 9780824748708, ISBN-10: 0824748700
Publisher: CRC Press
Date: February 2004 -
Electronic Packaging Materials and Their Properties
Author: Michael Pecht
ISBN-13: 9780849396250, ISBN-10: 0849396255
Publisher: Taylor & Francis, Inc.
Date: December 1998 -
Handbook Of Tape Automated Bonding
Author: John H. Lau
ISBN-13: 9780442004279, ISBN-10: 0442004273
Publisher: Springer-Verlag New York, LLC
Date: January 1992 -
Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications (2nd ed)
Author: James J. Licari
ISBN-13: 9780815512356, ISBN-10: 081551235X
Publisher: Elsevier Science
Date: December 1990 -
Quality Conformance and Qualification of Microelectronic Packages and Interconnects (New Edition)
Author: Michael Pecht
ISBN-13: 9780471594369, ISBN-10: 0471594369
Publisher: Wiley, John & Sons, Incorporated
Date: November 1994 -
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
Author: Dean L. Monthei
ISBN-13: 9780792383642, ISBN-10: 0792383648
Publisher: Springer-Verlag New York, LLC
Date: October 2007 -
Electronic Equipment Packaging Technology
Author: Gerald L. Ginsberg
ISBN-13: 9780442238186, ISBN-10: 0442238185
Publisher: Springer-Verlag New York, LLC
Date: December 2009 -
Advanced Wirebond Interconnection Technology
Author: Shankara K. Prasad
ISBN-13: 9781402077623, ISBN-10: 1402077629
Publisher: Springer-Verlag New York, LLC
Date: December 2009 -
Materials for High-Density Electronic Packaging and Interconnection:
Author: Committee on Materials for High-Density Electronic Packaging
ISBN-13: 9780309042338, ISBN-10: 030904233X
Publisher: National Academies Press
Date: January 1990 -
MCM C/Mixed Technologies and Thick Film Sensors
Author: W.K. Jones
ISBN-13: 9780792334606, ISBN-10: 0792334604
Publisher: Springer-Verlag New York, LLC
Date: October 2007 -
1998 2nd Electronic Packaging Technology Conference
Author: IEEE Power Electronics Society
ISBN-13: 9780780351417, ISBN-10: 078035141X
Publisher: IEEE
Date: April 1999 -
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Author: Michael G. Pecht
ISBN-13: 9780471594468, ISBN-10: 0471594466
Publisher: Wiley, John & Sons, Incorporated
Date: March 1994 -
Soldering Processes (New Edition)
Author: Pecht
ISBN-13: 9780471591672, ISBN-10: 047159167X
Publisher: Wiley, John & Sons, Incorporated
Date: June 1993 -
Application of Fracture Mechanics in Electronic Packaging: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997
Author: William T. Chen
ISBN-13: 9780791818275, ISBN-10: 0791818276
Publisher: American Society of Mechanical Engineers
Date: January 1997 -
The Basics Of Soldering
Author: Rahn
ISBN-13: 9780471584711, ISBN-10: 0471584711
Publisher: Wiley, John & Sons, Incorporated
Date: March 1993 -
The Handbook of Machine Soldering: SMT and TH (REV)
Author: Ralph W. Woodgate
ISBN-13: 9780471139041, ISBN-10: 0471139041
Publisher: Wiley, John & Sons, Incorporated
Date: September 1996 -
Microscale Heat Transfer - Fundamentals And Applications
Author: S. Kakac
ISBN-13: 9781402033599, ISBN-10: 1402033591
Publisher: Springer-Verlag New York, LLC
Date: June 2005 -
Chip On Board
Author: John H. Lau
ISBN-13: 9780442014414, ISBN-10: 0442014414
Publisher: Springer-Verlag New York, LLC
Date: July 2008 -
Electronic Packaging for High Reliability, Low Cost Electronics, Vol. 57
Author: R.R. Tummala
ISBN-13: 9780792352181, ISBN-10: 0792352181
Publisher: Springer-Verlag New York, LLC
Date: October 2007 -
Materials For Electronic Packaging
Author: Deborah Chung
ISBN-13: 9780750693141, ISBN-10: 0750693142
Publisher: Elsevier Science
Date: April 1995
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