You are not signed in. Sign in.
Share:
Category Books
- Fiction Books & Literature
- Graphic Novels
- Horror
- Mystery & Crime
- Poetry
- Romance Books
- Science Fiction & Fantasy
- Thrillers
- Westerns
- Ages 0-2
- Ages 3-5
- Ages 6-8
- Ages 9-12
- Teens
- Children's Books
- African Americans
- Antiques & Collectibles
- Art, Architecture & Photography
- Bibles & Bible Studies
- Biography
- Business Books
- Christianity
- Computer Books & Technology Books
- Cookbooks, Food & Wine
- Crafts & Hobbies Books
- Education & Teaching
- Engineering
- Entertainment
- Foreign Languages
- Game Books
- Gay & Lesbian
- Health Books, Diet & Fitness Books
- History
- Home & Garden
- Humor Books
- Judaism & Judaica
- Law
- Medical Books
- New Age & Spirituality
- Nonfiction
- Parenting & Family
- Pets
- Philosophy
- Political Books & Current Events Books
- Psychology & Psychotherapy
- Reference
- Religion Books
- Science & Nature
- Self Improvement
- Sex & Relationships
- Social Sciences
- Sports & Adventure
- Study Guides & Test Prep
- Travel
- True Crime
- Weddings
- Women's Studies
1998 2nd Electronic Packaging Technology Conference »
Authors: IEEE Power Electronics Society, Tay Andrew A. O.
ISBN-13: 9780780351417, ISBN-10: 078035141X
Format: Paperback
Publisher: IEEE
Date Published: April 1999
Edition: (Non-applicable)
Author Biography: IEEE Power Electronics Society
Book Synopsis
Table of Contents
| SLIM: Third Generation Of Packaging Beyond MCM, CSP, Flipchip And Micro-Via Board Technologies | 1 | |
| Trends In Assembly Processes For Miniaturised Consumer Electronics | 9 | |
| Testing For Reliability - Relevant Or Misleading? | 10 | |
| New Era For High Performance And Low Cost Semiconductor Packaging | 12 | |
| The Mini Flex Ball-Grid-Array Chip-Scale Package | 13 | |
| Fine Geometry And Fine Pitch Bumping Process | 18 | |
| Chip Bumping For Rework On FCOB Assembly Line | 25 | |
| Development Of Plastic Chip Scale Package For ATM Switching Systems | 30 | |
| Vapor Pressure Analysis Of Popcorn Cracking In Plastic IC Packages By Fracture Mechanics | 36 | |
| Thin Film Failure Using An Interface Delamination Law | 43 | |
| Reliability Investigations Of Flip Chip Interconnects In FCOB And FCOG Applications By FEA | 49 | |
| Parametric Finite Element Analysis Of Solder Joint Reliability Of Flip Chip On Board | 57 | |
| Best Practices in Automated Underfill Dispensing | 63 | |
| Eutectic Pb/Sn Solder Bump And Under Bump Metallurgy Interfacial Reactions And Adhesion | 69 | |
| Flip Chip On Board Mounting Processes Using Anisotropic Conductive Adhesives And Eutectic Solder | 76 | |
| The Ultra CSP Wafer Scale Package | 83 | |
| The Effects Of Immersion Zincation To The Electroless Nickel Under-Bump Materials In Microelectronics Packaging | 89 | |
| A Novel Method For Simultaneous Switching Noise Analysis In Electronic Packages | 95 | |
| Parasitic Extraction And Performance Evaluation Of A High I/O Package | 99 | |
| EBGA : High Frequency Electrical Characterization And The Influence Of Substrate Design Parameters On Package Performance | 107 | |
| Via Design Optimisation For High Speed Device Packaging | 112 | |
| Electrical Modeling Of Anisotropically Conductive Adhesive Interconnections For Microwave Applications | 119 | |
| Laminar Convection Behaviour in Microchannels In Conventional Thermal Entry Length And Beyond | 126 | |
| Cooling Solutions For A No-Air-Flow And Low-Junction-Temperature Application | 133 | |
| Direct Approach To The Design Of Plate Fin Heat Sinks Stack Cooled By Forced Convection | 138 | |
| Thermosphon-Cooled Bellow Liquid Heat Sink | 143 | |
| Experimental Investigation On A Closed Mini-Thermosyphon | 147 | |
| Boundary Element Analysis Of Delamination In IC Packages | 153 | |
| Fracture-Mechanics Based Delamination Growth Prediction In The Very Small Periphery Array (VSPA) Package | 160 | |
| Finite Element Analysis Of Plastic-Encapsulated Multi-Chip Packages | 170 | |
| Lifetime And Damage Assessment For CSPs And Related Microelectronic Structures: Experimental Validation Plus Computer Modeling | 177 | |
| Sensitivity Study Of Temperature And Strain Rate Dependent Properties On Solder Joint Fatigue Life | 184 | |
| Bonding Of Gold Wire To Electrolytic And Immersion Gold-Plated FR-4 Laminates At Low Temperature | 190 | |
| Novel Rework Techniques For Electronic Assemblies | 196 | |
| The Vibration Characteristics Of Capillary In Wire Bonder | 202 | |
| European Environmental Legislation In Electronics And Its Potential Impact On Far Eastern Suppliers | 206 | |
| W. A. V. E. Technology For Wafer Level Packaging Of lcs | 214 | |
| In-Situ Calibration Of Wire Bonder Ultrasonic System Using Integrated Microsensor | 219 | |
| Compressible Effects In Microchannel Flows | 224 | |
| The Enhanced Cooling Of IC Chip Arrays On Printed Circuit Boards | 229 | |
| Thermal Transient Testing Of Packaging Without A Tester | 236 | |
| A Thermal Model Of The Preheat Section In Wave Soldering | 240 | |
| Heat Transfer And Flow Issues In Manifold Microchannel Heat Sinks: A CFD Approach | 246 | |
| Thermal Characterization Of Electrically Conductive Adhesive Flip-Chip Joints | 251 | |
| Vibration Reliability Test Of A PBGA Assembly | 258 | |
| The Effect Of Reflow Condition On The Characteristics Of PBGA Solder Joint | 264 | |
| Reliability Assessment Of Flip Chip On Board Connections | 269 | |
| Reliability Assessment Of Transfer Molded CSP | 274 | |
| Thermal Fatigue Life Prediction For Solder Joints With The Consideration Of Damage Evolution | 279 | |
| Measurement Of Residual Stresses In Encapsulant Of A PQFP | 286 | |
| The Influence Of Fillet Height Of A Low Modulus Die Attach On The Wirebondability Of A Plastic Package | 291 | |
| Influence Of Material Combination On Warpage And Reflow Crack Resistance Of PBGA | 296 | |
| Microstructural Evolution Of Low Temperature Solders In Solder Joints On A Flexible Substrate | 302 | |
| Measurement On Thermal Properties Of solid Films In Electronic Packages | 308 | |
| Robust Loop Parameters For Ball Neck Strength Enhancement | 313 | |
| High Filler Loading Technique And Its Effects On The Reliability Of Epoxy Molding Compound | 318 | |
| Recent Progress In Popcorn Performance And Cost Reduction Of QFP160 Using Ni/Pd Plated Dambar Less Leadframes | 325 | |
| The Impact Of Die Attach Material On Type II Popcorn Cracking | 331 | |
| Effect Of Mold Resin On Reliability In Gold-Aluminium Bonding | 338 | |
| Underfill Material Requirements For Reliable Flip Chip Assemblies | 345 | |
| Investigation Of The Adhesion Strength Between Molding Compound And Leadframe At Higher Temperatures | 349 | |
| Rheological Analysis Of A Underfill Material | 354 | |
| A Fast, Low Cost Method To Check For Moisture In Epoxy Molding Compound | 359 |
Subjects
