Electronic Packaging Materials and Their Properties »

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

Booknews

A text on the enclosures for integrated circuit chips, passive devices, the fabrication of circuit cards, and the production of a final product or system. The authors cover electronic packaging architecture, semiconductor materials, interconnection materials for component attachment to a substrate, materials used to fabricate a printed wiring board, quality and reliability issues, and the electrical, mechanical, chemical, and thermal properties of all electronic packaging materials. Includes many tables and diagrams which summarize relevant data. Annotation c. by Book News, Inc., Portland, Or.