Authors: Shankara K. Prasad
ISBN-13: 9781402077623, ISBN-10: 1402077629
Format: Hardcover
Publisher: Springer-Verlag New York, LLC
Date Published: December 2009
Edition: (Non-applicable)
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
A CD-ROM is included, which contains 2D and 3D animations of many concepts that are discussed in this book. The animations with voice-overs help the reader grasp the ideas faster with visual experience, which leads to better retention.
Preface | ||
Acknowledgments | ||
Ch. 1 | Introduction | 1 |
Ch. 2 | Materials for wirebonding | 17 |
Ch. 3 | Bonding equipment | 95 |
Ch. 4 | Process technology | 163 |
Ch. 5 | Quality | 481 |
Ch. 6 | Reliability | 559 |
Ch. 7 | New technologies and new applications for wire bonding | 629 |
References | 655 | |
Index | 661 | |
About the author | 669 |