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Silicon VLSI Technology : Fundamentals, Practice, and Modeling » (1st Edition)

Book cover image of Silicon VLSI Technology : Fundamentals, Practice, and Modeling by James D. Plummer

Authors: James D. Plummer
ISBN-13: 9780130850379, ISBN-10: 0130850373
Format: Paperback
Publisher: Prentice Hall
Date Published: July 2000
Edition: 1st Edition

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Author Biography: James D. Plummer

JAMES D. PLUMMER, PETER B. GRIFFIN, and MICHAEL D. DEAL, all of Stanford University

Book Synopsis

Unique in approach, this book provides an integrated view of silicon technology—with an emphasis on modern computer simulation. It describes not only the manufacturing practice associated with the technologies used in silicon chip fabrication, but also the underlying scientific basis for those technologies.

Modern CMOS Technology. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers. Semiconductor Manufacturing—Clean Rooms, Wafer Cleaning and Gettering. Lithography. Thermal Oxidation and the Si/SiO<V>2 Interface. Dopant Diffusion. Ion Implantation. Thin Film Diffusion. Etching. Backend Technology.

For anyone interested in Fabrication Processes.

Table of Contents

(NOTE: Chapters 3-11 include an Introduction, Historical Development and Basic Concepts, Manufacturing Methods and Equipment, Measurement Methods, Models and Simulation, Limits and Future Trends in Technologies and Models, Summary of Key Ideas, References, and Problems.)

1. Introduction and Historical Perspective.

Introduction. Integrated Circuits and the Planar Process—Key Inventions That Made It All Possible. Semiconductors. Semiconductor Devices. Semiconductor Circuit Families. Modern Scientific Discovery—Experiments, Theory and Computer Simulation. The Plan for This Book.

2. Modern CMOS Technology.

CMOS Process Flow.

3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers.

4. Semiconductor Manufacturing— Clean Rooms, Wafer Cleaning and Gettering.

5. Lithography.

6. Thermal Oxidation and the Si/SiO2 Interface.

7. Dopant Diffusion.

8. Ion Implantation.

9. Thin Film Deposition.

10. Etching.

11. Backend Technology.

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