Authors: Sami Franssila
ISBN-13: 9780470749838, ISBN-10: 0470749830
Format: Hardcover
Publisher: Wiley, John & Sons, Incorporated
Date Published: November 2010
Edition: 2nd Edition
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered.
This second edition includes:
With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike.
www.wiley.com/go/Franssila_Micro2e
Pt. I | Introduction | 1 |
1 | Introduction | 3 |
2 | Micrometrology and materials characterization | 17 |
3 | Simulation of microfabrication processes | 27 |
Pt. II | Materials | 33 |
4 | Silicon | 35 |
5 | Thin film materials and processes | 47 |
6 | Epitaxy | 65 |
7 | Thin-film growth and structure | 73 |
Pt. III | Basic Processes | 91 |
8 | Pattern generation | 93 |
9 | Optical lithography | 99 |
10 | Lithographic patterns | 107 |
11 | Etching | 119 |
12 | Wafer cleaning and surface preparation | 133 |
13 | Thermal oxidation | 143 |
14 | Diffusion | 153 |
15 | Ion implantation | 159 |
16 | CMP : Chemical-mechanical polishing | 165 |
17 | Bonding and layer transfer | 173 |
18 | Molding and stamping | 183 |
Pt. IV | Structures | 191 |
19 | Self-aligned structures | 193 |
20 | Plasma etched structures | 199 |
21 | Wet-etched silicon structures | 205 |
22 | Sacrificial and released structures | 217 |
23 | Structures by deposition | 227 |
Pt. V | Integration | 235 |
24 | Process integration | 237 |
25 | CMOS transistor fabrication | 255 |
26 | Bipolar technology | 269 |
27 | Multilevel metallization | 277 |
28 | MEMS process integration | 287 |
29 | Processing on non-silicon substrates | 301 |
Pt. VI | Tools | 307 |
30 | Tools for microfabrication | 309 |
31 | Tools for hot processes | 315 |
32 | Vacuum and plasmas | 321 |
33 | Tools for CVD and epitaxy | 329 |
34 | Integrated processing | 337 |
Pt. VII | Manufacturing | 341 |
35 | Cleanrooms | 343 |
36 | Yield | 349 |
37 | Wafer fab | 355 |
Pt. VIII | Future | 361 |
38 | Moore's law | 363 |
39 | Microfabrication at large | 373 |